Most motion sensors available in today’s market are based on multi-chip technology developed in the 1980s. In this approach, the mechanical sensor (MEMS) and the drive electronics (IC) are manufactured in different facilities using different processing techniques. The two chips are tested separately and then wired together during packaging.
The disadvantages of this approach include the size and cost of two chips, the cost and capacity constraints of specialized MEMS fabrication and the performance limitations of interconnecting two separate chips into a single package.
mCube has developed a unique monolithic single-chip MEMS technology allowing for extremely cost-effective, high performance motion sensors. With the mCube approach, the MEMS sensors are fabricated directly on top of the IC electronics in a standard CMOS fabrication facility. Advantages of this monolithic approach include smaller size, higher performance, lower cost, and the ability to integrate multiple sensors onto a single-chip.
|Monolithic MEMS on CMOS IC|
|MEMS Fabrication in a CMOS Facility|
|Thick Silicon MEMS|
|Through-Silicon Electrical Contacts|
|Hermetically Sealed MEMS|